Intel has competition after many years. And it is that AMD has done really well with both the Ryzen 7 and the Ryzen 5, which little by little begin to debug their initial problems and have managed to get Intel’s X99 and Z270 platforms, although very mature and refined, to start to seem somewhat expensive if we compare them with the prices offered by the competition. Intel is aware of this, and that is why we have been able to find out through the Chinese web
In June we will have here the new Intel HEDT platform: This will be Skylake-X.
According to the aforementioned Chinese website, the next Skylake X (not Skylake-E) would be advanced from the beginning of August until early june, specifically a period is considered that goes from May 30 to June 3 coinciding with the next Taipei Computex, which makes a lot of sense if Intel wants to take advantage of the media coverage of this fair to give maximum publicity to its new platform.
As I already told you at Gizlogic, this new high-performance platform for the home will make use of a new LGA 2066 socket (Originally there was talk of 20161 pins) and as usual in this segment, they would lack integrated graphics in order to offer the maximum possible CPU performance with a maximum TDP that for now would continue to remain at 140 watts.
It also does not seem that Intel wants to throw the house out the window, and it is that with Skylake X we would continue to see 6, 8 and 10 core proposals (maybe with Cannonlake we do see 12 cores), with up to 4 memory channels, so the basic structure of the platform seems to remain intact (something else will be the domain of the servers, where a new and gigantic socket is expected LGA 3647 with up to 6 memory channels to compete with AMD Naples),
We can at least hope that Intel will tighten its belt and offer somewhat tighter prices, since if we take into account that Skylake offers a CPI between 5 and 10% higher than Broadwell, it does not seem at first that we are going to see an increase performance is too significant compared to Broadwell Extreme or that therefore the differences are going to be too large compared to Ryzen, which, let’s not forget, also has a revision on the way that would improve its performance.
Where certain improvements are expected is in the memory support, since while Kaby Lake offers official support for modules up to 2400 MHz, future Skylake-Xs would go up up to 2666MHz. And although this is interesting, what most intrigues us is knowing the compatibility of this future HEDT platform with high-frequency DDR4 modules (our X99 board does not exceed 3333MHz), since a 4-channel system with 4000 MHz modules it could throw in some pretty interesting bandwidths. It will therefore be necessary to see how the memory controllers of the future Skylake-X processors will behave.
Kaby Lake 4-core without integrated graphics ?: Could be.
Although it does not seem that Skylake-X is going to overturn Intel’s current paradigm for its extreme range, there could be a rather curious novelty, and it is the fact of using Kaby Lake-X not as a successor to Skylake-X (as yes has occurred in the mid-range with LGA 1151 socket), but rather as a way to access Intel’s HEDT platform with 4-core processors at a lower cost and that would coexist in time with the Skylake 6, 8 and 10 processors nuclei.
Let’s not forget that currently, the Intel i7 6800K is the cheapest Broadwell-E micro that can be purchased for the X99 platform and has a total of 6 cores; so that Kaby Lake-X would return the 4 cores to the HEDT platform, acting as a micro “entry” that allows us to acquire a motherboard with a much greater upgrade potential than that offered by the LGA 1151 socket, but at a somewhat lower cost.
According to BenchLife, future Kaby Lake-X would do without the integrated graphics and increase their TDP from the current 91W of the i7 7700k up to 112W, allowing very high operating frequencies (5 GHz as standard?) that would be possible thanks to an improved manufacturing process 14nm +.
Both Skylake-X and Kaby Lake-X will use a PCH Kaby Lake which would also be compatible with future Cannonlake-X processors, of which a 12-core model is expected and a maximum of 48 PCI-Express lanes.
Thus, it remains to be seen to what extent Intel’s next platform will be competitive against AMD’s proposals and if these hypothetical hyper-vitaminized Kaby Lake-X come true. We will be attentive to future leaks.
Source: Videocardz, Gizlogic